Vacuum reflow experiment service
A service to evaluate and verify stable solder connection conditions through experimentation.
We offer a "Vacuum Reflow Experiment Service." By creating a vacuum (reduced pressure) environment during solder reflow, we adjust the reflow conditions. In reflow processes using flux, partially removing flux gas helps suppress the occurrence of voids (bubbles), enabling high-quality solder connections. We can accommodate not only lead-free SAC solder but also low-melting-point tin-bismuth solder and high-melting-point gold-tin solder. We will provide the most suitable solder for your products. It is also possible to choose nitrogen or hydrogen-added nitrogen for the melting environment. 【Service Features】 ■ High-quality connections can be achieved while suppressing void formation in the manufacturing of flip chips using gold-tin solder. ■ Stable solder connections are realized even in high-power ED manufacturing experiments. ■ This service is also utilized in the production of multi-chips and UV LEDs, allowing for assembly with SAC solder. *Due to constraints such as substrate size, individual consultations will be conducted to propose the optimal solutions.
- Company:佐用精機製作所
- Price:Other