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Experimental Services - List of Manufacturers, Suppliers, Companies and Products

Experimental Services Product List

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Vacuum reflow experiment service

A service to evaluate and verify stable solder connection conditions through experimentation.

We offer a "Vacuum Reflow Experiment Service." By creating a vacuum (reduced pressure) environment during solder reflow, we adjust the reflow conditions. In reflow processes using flux, partially removing flux gas helps suppress the occurrence of voids (bubbles), enabling high-quality solder connections. We can accommodate not only lead-free SAC solder but also low-melting-point tin-bismuth solder and high-melting-point gold-tin solder. We will provide the most suitable solder for your products. It is also possible to choose nitrogen or hydrogen-added nitrogen for the melting environment. 【Service Features】 ■ High-quality connections can be achieved while suppressing void formation in the manufacturing of flip chips using gold-tin solder. ■ Stable solder connections are realized even in high-power ED manufacturing experiments. ■ This service is also utilized in the production of multi-chips and UV LEDs, allowing for assembly with SAC solder. *Due to constraints such as substrate size, individual consultations will be conducted to propose the optimal solutions.

  • Reflow Equipment
  • Other contract services
  • Other semiconductors

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Vacuum Cap Seal Experiment Service

Vacuum cap seal experimental service that can eliminate the effects of gas.

We offer a "Vacuum Cap Seal Experiment Service." This service involves removing the gas (usually air or nitrogen) inside the cap during the cap sealing process. You can confirm the impact of the gas inside the cap on sensor functionality. It is useful for experiments with special purposes such as verifying the operation of MEMS and gas sensors. Since we can accommodate from a single item, it can also be used for individual tests. It is necessary to individually design electrodes and surrounding structures that can handle vacuum conditions. 【Examples】 - Experimental samples to confirm whether the operation of MEMS changes at reduced pressure levels. - Investigation of the impact of gas inside the cap on sensor output. Depending on the shape and size of the stem and cap, we may not be able to accommodate certain requests. Please consult us when using the service.

  • Other contract services
  • Other semiconductors

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Gas Replacement Can Seal Experiment Service

Service for changing gas in the camp package and producing experimental samples.

We offer a "Gas Conversion Cap Seal Experiment Service." This service changes the gas inside the cap package from one gas to another, different from the atmosphere. For special experimental applications such as gas sensors, it is possible to convert the gas inside the cap to inert gases and seal it. Since the gas inside the cap can be selected, it is possible to improve the reliability and accuracy of experiments. It is necessary to design and manufacture the electrodes and their surrounding structures as fixtures. Individual designs are required for each customer. 【Examples】 ■ We accommodate the production of experimental samples where the gas inside the cap is an issue, such as for gas sensors or special wavelengths. There are limitations on the sizes and types of gases we can handle, so please consult us separately before implementation. We also accommodate special requirements for each customer.

  • Other contract services
  • Other semiconductors

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Transfer Mold Experiment Service

Transfer mold molding experiment service

We offer "Transfer Molding Experiment Services." This is an experimental service using transfer molding machines that primarily mold semiconductors with epoxy resin. In collaboration with mold manufacturers, we conduct everything from mold creation to transfer molding experiments. We can maintain high design accuracy for items such as lenses and also provide support for mold design. Joint experiments with resin manufacturers, mold manufacturers, substrate manufacturers, and end customers are possible, allowing for efficient molding experiments. It is possible to create products with high design accuracy intended for mass production. 【Examples】 - Infrared photo sensors using lead frames - Photo sensors and infrared light-emitting units on substrates - Green LED mounting samples for optical communication It is also possible to conduct preliminary experiments using simple molding molds before mold production. Please take advantage of our experimental services using materials such as silicone and epoxy resin.

  • Other contract services
  • Other semiconductors

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Molding experiment service using simple molding type

From shape design to optical evaluation, easily create samples! We propose the production of experimental samples using simple molds such as Teflon and silicone molds.

We offer a "simple molding type molding experiment service." This is a simple molding experiment service to evaluate the shape and lens accuracy when designing light-emitting and light-receiving elements as optical components. We manufacture a 3D machined mold using Teflon resin to create a mold for lens formation.

  • Bullet-shaped LED
  • Chip type LED
  • Lamps and light emitting devices

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High-speed spectroscopic product on-site testing service

We offer an on-site experimental service where you can use our latest spectroscopic products in the demo room.

At our company, we would like you to confirm the performance of the products you are interested in before making a purchase, and we hope you will be satisfied with your purchase afterward. We also wish to assist customers who may find it difficult to purchase equipment by allowing them to conduct measurements, contributing to their research. Therefore, we have established a demonstration room for our latest products and offer on-site experiments (free or for a fee*).

  • Spectroscopic Analysis Equipment

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Gold-tin (AuSn) reflow bonding experiment service

We will solve your problems with experiments using AuSn (high-temperature solder).

Soldering with AuSn is used for joining electronic components that require high reliability. It has many advantages, such as utilizing its high melting temperature characteristics and being usable as an initial joining material when attempting to join materials. However, there are some difficulties compared to conventional soldering, such as: - Processing in areas exceeding 300°C - Need for atmosphere management during solder melting, such as in an N2 environment - The surface condition of the joined objects is influenced by the composition of the plating - Difficulty in positioning the workpiece during connection, etc. Our company has experience in mass production for optical pickups and communication LDs for major manufacturers. Through this experience, we have addressed many customer issues through prototyping. 【Service Features】 - Support including substrate design and joining jig design - For LED flicker chips, we can perform joining not only with non-flux but also with flux - We also have AIN submounts, LEDs, and packages in stock as experimental materials Please feel free to consult us if you have urgent experimental needs or any other concerns.

  • Other electronic parts
  • LED Module
  • Capacitor

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Simple Sulfurization Discoloration Comparison Experiment Service

Are you having trouble with brightness degradation evaluation? We propose a simple comparative assessment.

We offer a "Simple Sulfide Discoloration Comparison Experiment Service" for evaluating the sulfide discoloration of silver-plated materials. In the case of LED lighting, the degradation of brightness due to factors such as the inner surface of the package, particularly the silver-plated surface, becomes a concern. This issue is unavoidable for outdoor lighting applications where the impact of sulfide on the silver-plated surface cannot be ignored. Similar problems may also arise in infrared centers depending on the application. It is possible to evaluate the discoloration of silver plating on packaged materials and to easily assess the gas barrier properties of the materials used. 【Service Examples】 ■ Storing reference and evaluation samples together in a wide-mouth bottle to observe changes over time ■ Evaluating gas barrier properties through comparison of discoloration on the silver-plated surface

  • LED Module
  • Other electronic parts
  • Analysis Services

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Resin Coating Experiment Service

We respond to diverse needs during resin coating experiments.

We offer a "Resin Coating Experiment Service." We provide the creation of evaluation samples for material development, operational experiment samples, and optical lens bonding. The purpose of the experiments is for the production of electronic components and the development of coatings and adhesives for electronic materials. Samples are produced and evaluated, and they are used for comparative studies such as strength and degradation tests.

  • Sensors
  • Bullet-shaped LED
  • LED Module

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Joint Strength Comparison Experiment Service

Are there any issues with the bonding strength of wire bonds, die bonds, and materials?

We will conduct a comparative measurement of the bonding strength at the junctions of wire bonds, die bonds, and materials. This is effective for addressing variations in bonding strength that may arise as a result of material development, element development, and substrate development. It is possible to evaluate issues related to the bonding strength of wire bonds, such as reliability and problems after heat treatment. We will compare the bonding strength itself in the state of the materials and assess the quality of strength among multiple samples. It is also possible to evaluate the effects of heat treatment. We also offer services to evaluate cases where the strength varies at the bonding surface. This can be utilized for material testing evaluations during mass production development. When the structure, material structure, or molecular structure between materials can be determined, it is possible to measure the bonding strength of the materials themselves. 【Examples】 - Comparative experiments on bonding strength when variations occur during the development of materials, elements, and substrates. - Evaluation when issues with bonding strength are found after heat treatment. - Comparative experiments on bonding strength to conduct multiple material testing evaluations during mass production development. - Measurement of the strength of the resin itself that has been bonded. *For more details, please refer to the PDF document or feel free to contact us.

  • LED Module
  • Contract Analysis

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Simple ACF (Anisotropic Conductive Film) Implementation Experiment Service

Achieved improvements in the joining process through a simple ACF implementation experiment.

We offer a "Simple ACF (Anisotropic Conductive Film) Implementation Experiment Service." ACF is a material in which metal particles or tiny resin beads are metallized and dispersed within a resin film as a conductive material. It is a bonding material that achieves electrical connections with narrow pitch by applying pressure and heat. It is necessary to place the ACF between the substrate and the bonding target, applying horizontal pressure while simultaneously heating. Although it is a jig-level device, we are conducting experiments.

  • Other electronic parts
  • LED Module

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Contracted experimental services for ultra-high temperature heating at 3000℃.

Please use this for preliminary verification of equipment considerations! We also accept contract manufacturing for small lots.

At Daiichi Kiden Co., Ltd., we accept commissioned experiments and can conduct heating experiments above 3000°C in an inert atmosphere using a high-frequency induction heating power supply with a carbon crucible. By utilizing high-frequency induction heating, we achieve a heating rate of 3000°C/h and employ power control that offers good reproducibility and stability. Additionally, accurate temperature measurement is possible with a two-color radiation thermometer. 【Experiment Specifications】 ■ Heating Temperature: Up to 3000°C ■ Atmosphere: Inert gas atmosphere at atmospheric pressure after vacuum evacuation ■ Recommended Crucible: Carbon, inner diameter φ50(t2)xH48mm ■ Hot Zone: Carbon molded insulation material ■ Heating Method: High-frequency induction heating ■ Heating Rate: 1 to 3000°C/h *For more details, please refer to the PDF document or external link page, or feel free to contact us.

  • Other contract services

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CanSeal Experiment Service

We provide metal can seal experimental services, covering everything from electrode design to evaluation!

We offer "Can Seal Experiment Services." We perform electric resistance welding of metal stems with metal caps or metal caps with window glass. We have two types of equipment: one for welding in a glove box and another for cap entry and exit in an air environment. We can handle everything from electrode design to welding evaluation. We also accommodate items other than general TO cans. *Please feel free to consult with us.

  • Other electronic parts
  • LED Module
  • Lamps and light emitting devices

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Simple Optical Sheet Production Experiment Service

We provide high-quality evaluation sheets in a short period! Achieve efficient comparative experiments with minimal material usage.

We offer a "Simple Optical Sheet Creation Experiment Service" to create sheets that are optimal for evaluating phosphors and additives. We can produce optical sheets of thin films on glass substrates with a very small amount of sample material. This service is particularly effective in the early stages of material development when multi-level evaluations are necessary. It is mainly used for the evaluation of phosphors and additives. No experimental fixtures such as mold materials or calendar rolls are required. By coordinating effectively, you can shorten experimental time and achieve efficient development through comparative experiments with minimal material usage. Please consider using this service in the early stages of development.

  • plastic
  • Other polymer materials
  • LED Module

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